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Intel® Q370 Chipset

Intel® H370 Chipset

Intel® B360 Chipset

Hal Penting


Koleksi Produk
Segmen Vertikal
Status
Tanggal Peluncuran
TDP
Kondisi Penggunaan


Koleksi Produk	Intel® 300 Series Desktop Chipsets	Intel® 300 Series Desktop Chipsets	Intel® 300 Series Desktop Chipsets
Segmen Vertikal	Desktop	Desktop	Desktop
Status	Launched	Discontinued	Discontinued
Tanggal Peluncuran	Q2'18	Q2'18	Q2'18
TDP	6 W	6 W	6 W
Kondisi Penggunaan	Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet	PC/Client/Tablet	PC/Client/Tablet


Koleksi Produk	Intel® 300 Series Desktop Chipsets Intel® 300 Series Desktop Chipsets Intel® 300 Series Desktop Chipsets
Segmen Vertikal	Desktop Desktop Desktop
Status	Launched Discontinued Discontinued
Tanggal Peluncuran	Q2'18 Q2'18 Q2'18
TDP	6 W 6 W 6 W
Kondisi Penggunaan	Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet PC/Client/Tablet PC/Client/Tablet

Informasi Tambahan


Tersedia Opsi Terpasang
Lembar Data


Tersedia Opsi Terpasang	Ya	Tidak	Tidak
Lembar Data	Lihat sekarang	Lihat sekarang	Lihat sekarang


Tersedia Opsi Terpasang	Ya Tidak Tidak
Lembar Data	Lihat sekarang Lihat sekarang Lihat sekarang

Spesifikasi Memori


Jumlah DIMM per saluran
Mendukung Memori ECC ^‡
Mendukung Overclocking Memori


Jumlah DIMM per saluran	2	2	2
Mendukung Memori ECC ^‡	No	No	No
Mendukung Overclocking Memori	Tidak	Tidak	Tidak


Jumlah DIMM per saluran	2 2 2
Mendukung Memori ECC ^‡	No No No
Mendukung Overclocking Memori	Tidak Tidak Tidak

Spesifikasi GPU


Jumlah Layar yang Didukung ^‡


Jumlah Layar yang Didukung ^‡	3	3	3


Jumlah Layar yang Didukung ^‡	3 3 3

Opsi Ekspansi


Revisi Direct Media Interface (DMI)
# Maksimum Jalur DMI
Revisi PCI Express
Konfigurasi PCI Express ^‡
Jumlah Maksimal Jalur PCI Express


Revisi Direct Media Interface (DMI)	3.0	3.0	3.0
# Maksimum Jalur DMI	4	4	4
Revisi PCI Express	3.0	3.0	3.0
Konfigurasi PCI Express ^‡	x1, x2, x4	x1, x2, x4	x1, x2, x4
Jumlah Maksimal Jalur PCI Express	24	20	12


Revisi Direct Media Interface (DMI)	3.0 3.0 3.0
# Maksimum Jalur DMI	4 4 4
Revisi PCI Express	3.0 3.0 3.0
Konfigurasi PCI Express ^‡	x1, x2, x4 x1, x2, x4 x1, x2, x4
Jumlah Maksimal Jalur PCI Express	24 20 12

Spesifikasi I/O


Jumlah Port USB
Konfigurasi USB
Revisi USB
Jumlah Maksimal Port SATA 6.0 Gb/s
Konfigurasi RAID
LAN Terintegrasi
Nirkabel Terintegrasi^‡
Konfigurasi Port PCI Express Prosesor yang Didukung


Jumlah Port USB	14	14	12
Konfigurasi USB	10 USB 3.1 Ports - Up to 6 USB 3.1 Gen 2 (10Gb/s) Ports - Up to 10 USB 3.1 Gen 1 (5Gb/s) Ports 14 USB 2.0 Ports	8 USB 3.1 Ports - Up to 4 USB 3.1 Gen 2 (10Gb/s) Ports - Up to 8 USB 3.1 Gen 1 (5Gb/s) Ports 14 USB 2.0 Ports	6 USB 3.1 Ports - Up to 4 USB 3.1 Gen 2 (10Gb/s) Ports - Up to 6 USB 3.1 Gen 1 (5Gb/s) Ports 12 USB 2.0 Ports
Revisi USB	3.1, 2.0	3.1, 2.0	3.1, 2.0
Jumlah Maksimal Port SATA 6.0 Gb/s	6	6	6
Konfigurasi RAID	PCIe 0,1,5 / SATA 0,1,5,10	PCIe 0,1,5 / SATA 0,1,5,10	N/A
LAN Terintegrasi	Integrated MAC	Integrated MAC	Integrated MAC
Nirkabel Terintegrasi^‡	Intel® Wireless-AC MAC	Intel® Wireless-AC MAC	Intel® Wireless-AC MAC
Konfigurasi Port PCI Express Prosesor yang Didukung	1x16 or 2x8 or 1x8+2x4	1x16	1x16


Jumlah Port USB	14 14 12
Konfigurasi USB	10 USB 3.1 Ports - Up to 6 USB 3.1 Gen 2 (10Gb/s) Ports - Up to 10 USB 3.1 Gen 1 (5Gb/s) Ports 14 USB 2.0 Ports 8 USB 3.1 Ports - Up to 4 USB 3.1 Gen 2 (10Gb/s) Ports - Up to 8 USB 3.1 Gen 1 (5Gb/s) Ports 14 USB 2.0 Ports 6 USB 3.1 Ports - Up to 4 USB 3.1 Gen 2 (10Gb/s) Ports - Up to 6 USB 3.1 Gen 1 (5Gb/s) Ports 12 USB 2.0 Ports
Revisi USB	3.1, 2.0 3.1, 2.0 3.1, 2.0
Jumlah Maksimal Port SATA 6.0 Gb/s	6 6 6
Konfigurasi RAID	PCIe 0,1,5 / SATA 0,1,5,10 PCIe 0,1,5 / SATA 0,1,5,10 N/A
LAN Terintegrasi	Integrated MAC Integrated MAC Integrated MAC
Nirkabel Terintegrasi^‡	Intel® Wireless-AC MAC Intel® Wireless-AC MAC Intel® Wireless-AC MAC
Konfigurasi Port PCI Express Prosesor yang Didukung	1x16 or 2x8 or 1x8+2x4 1x16 1x16

Spesifikasi Paket


Ukuran Paket


Ukuran Paket	23mm x 24mm	23mm x 24mm	23mm x 24mm


Ukuran Paket	23mm x 24mm 23mm x 24mm 23mm x 24mm

Teknologi Canggih


Memori Intel® Optane™ Didukung ^‡
Intel® Virtualization Technology for Directed I/O (VT-d) ^‡
Versi Intel® ME Firmware
Intel® HD Audio Technology
Intel® Rapid Storage Technology
Intel® Rapid Storage Technology enterprise
Intel® Standard Manageability
Intel® Stable Image Platform Program (SIPP)
Intel® Rapid Storage Technology untuk PCI Storage
Intel® Smart Sound Technology
Intel® Platform Trust Technology (Intel® PTT)
Intel® Rapid Start Technology


Memori Intel® Optane™ Didukung ^‡	Ya	Ya	Ya
Intel® Virtualization Technology for Directed I/O (VT-d) ^‡	Ya	Ya	Ya
Versi Intel® ME Firmware	12	12	12
Intel® HD Audio Technology	Ya	Ya	Ya
Intel® Rapid Storage Technology	Ya	Ya	Yes
Intel® Rapid Storage Technology enterprise	No	No	No
Intel® Standard Manageability	Ya	No	No
Intel® Stable Image Platform Program (SIPP)	Ya	No	No
Intel® Rapid Storage Technology untuk PCI Storage	Ya	Ya
Intel® Smart Sound Technology	Ya	Ya	Ya
Intel® Platform Trust Technology (Intel® PTT)	Ya	Ya	Ya
Intel® Rapid Start Technology			Ya


Memori Intel® Optane™ Didukung ^‡	Ya Ya Ya
Intel® Virtualization Technology for Directed I/O (VT-d) ^‡	Ya Ya Ya
Versi Intel® ME Firmware	12 12 12
Intel® HD Audio Technology	Ya Ya Ya
Intel® Rapid Storage Technology	Ya Ya Yes
Intel® Rapid Storage Technology enterprise	No No No
Intel® Standard Manageability	Ya No No
Intel® Stable Image Platform Program (SIPP)	Ya No No
Intel® Rapid Storage Technology untuk PCI Storage	Ya Ya
Intel® Smart Sound Technology	Ya Ya Ya
Intel® Platform Trust Technology (Intel® PTT)	Ya Ya Ya
Intel® Rapid Start Technology	Ya

Keamanan & Keandalan


Intel vPro® Eligibility ^‡
Intel® Trusted Execution Technology ^‡
Intel® Boot Guard


Intel vPro® Eligibility ^‡	Intel vPro® Platform
Intel® Trusted Execution Technology ^‡	Ya	No	No
Intel® Boot Guard	Ya	Ya	Ya


Intel vPro® Eligibility ^‡	Intel vPro® Platform
Intel® Trusted Execution Technology ^‡	Ya No No
Intel® Boot Guard	Ya Ya Ya

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