FPGA Seri Intel® Stratix® dan SoC
Intel® Stratix® FPGA dan Seri SoC menggabungkan densitas tinggi dan performa tinggi dengan beragam fitur untuk memungkinkan lebih banyak fungsi dan memaksimalkan bandwidth sistem, sehingga pelanggan dapat menghadirkan produk dengan performa tinggi dan canggih ke pasaran dengan risiko yang lebih rendah.
Bandingkan perangkat seri Intel® Stratix® dengan Pemilih Produk online kami.
FPGA Seri Intel® Stratix® dan SoC
Semua Generasi Stratix®
| Rangkaian Perangkat | Intel® Stratix® 10 | Stratix® V |
Stratix® IV |
Stratix® III |
Stratix® II GX |
Stratix® II | Stratix® GX | Stratix® |
|---|---|---|---|---|---|---|---|---|
| Tahun Perkenalan |
2013 | 2010 | 2008 | 2006 | 2005 | 2004 | 2003 | 2002 |
| Teknologi Proses |
14 nm |
28 nm | 40 nm | 65 nm | 90 nm | 90 nm | 130 nm | 130 nm |
Fitur Umum Seri Intel® Stratix®
Fitur evolusioner dan revolusioner telah disertakan pada rangkaian perangkat Intel® Stratix®.
| Teknologi |
Intel® Stratix® 10 |
Stratix® V | Stratix® IV |
|---|---|---|---|
| Modul Logika Adaptif | ✓ | ✓ | ✓ |
| Transceiver | ✓ | ✓ | ✓ |
| Daya | ✓ | ✓ | ✓ |
| Blok DSP | ✓ | ✓ | ✓ |
| Antarmuka Memori Eksternal | ✓ | ✓ | ✓ |
| Memori Tertanam | ✓ | ✓ | ✓ |
| Performa I/O | ✓ | ✓ | ✓ |
| Keamanan Desain | ✓ | ✓ | ✓ |
| Mitigasi Single-Event Upset | ✓ | ✓ | ✓ |
| Peningkatan Sistem dari Jarak Jauh | ✓ | ✓ | ✓ |
| Konfigurasi Ulang Parsial | ✓ |
✓ | |
| Teknologi Transistor 3D Tri-Gate | ✓ |
|
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| Sistem Prosesor Kuat | ✓ |
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| Arsitektur Intel® Hyperflex™ FPGA | ✓ |
|
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| Solusi 3D yang heterogen (SRAM, DRAM, dan ASIC) | ✓ |
|
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| Titik Ambang Presisi Tunggal IEEE 754 yang Kuat | ✓ |
|
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| Blok Tensor AI | ✓ |
Sumber Daya Tambahan
Jelajahi konten lainnya terkait perangkat Intel® FPGA seperti board pengembangan, kekayaan intelektual, dukungan, dan banyak lagi.
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