Hal Penting

Status
Discontinued
Tanggal Peluncuran
Q2'21
Penghentian yang Diperkirakan
2023
EOL Announce
Friday, May 5, 2023
Pesanan Terakhir
Friday, June 30, 2023
Garansi terbatas 3 tahun
Ya
Perpanjangan Garansi Dapat Dibeli (Negara Tertentu)
Ya
Rincian Jaminan yang Diperpanjang Tambahan
Seri Produk Kompatibel
3rd Generation Intel® Xeon® Scalable Processors
Faktor Bentuk Papan
8.33” x 21.5”
Faktor Bentuk Sasis
2U Rack
Soket
Socket-P4
BMC Terintegrasi dengan IPMI
IPMI 2.0 & Redfish
Papan Mudah Dipasang di Rak
Ya
TDP
270 W
Hal yang Disertakan
(1) Intel® Server Board D50TNP1SB
(1) 2U full-width module tray – iPN K85397
(1) 2U accelerator module air duct – iPN K85780
(2) 2U PCIe Riser (Two x16 PCIe slots, M.2 Connector and U.2 Connector) TNP2URISER, with U.2 PCIe* NVMe* SSD adapter card included
(2) 2U riser bracket to support TNP2URISER – iPN K25207
(2) 2.5” tool-less SSD drive carrier – iPN J36439
(2) M.2 heat sink assembly TNPM2HS
(1) 2U Air-Cooled front Heat Sink TNP2UHSF
(1) 2U Air-Cooled Rear Heat Sink TNP2UHSB
(2) Processor clip, for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484
(1) 2U PCIe Accelerator Riser (two x16 PCIe slots) TNPACCLRISER1
(1) 2U PCIe Accelerator Riser (two x16 PCIe slots) TNPACCLRISER2
(1) Accelerator module power connector board – iPC TNPACCLNBRD
(2) Power cable 110 mm to connect TNPACCLRISER1 and TNPACCLRISER 2 to TNPACCLNBRD – iPN K73519
(1 each) OCuLink cable 740 mm and 710 mm – iPN K87949
(2) OCuLink cable 260 mm – iPN K87954



Chipset Board
Pasar Target
High Performance Computing

Informasi Tambahan

Tersedia Opsi Terpasang
Tidak
Keterangan
A 2U high-density full-width Acceleration Module integrated with the Intel® Server Board D50TNP1SB intended to address acceleration solutions that support up to four 300 W PCIe* accelerator add-in cards.

Spesifikasi Memori

Ukuran Memori Maks (bergantung jenis memori)
6 TB
Jenis Memori
-DDR4 (RDIMM)
-3DS-RDIMM
-Load Reduced DDR4 (LRDIMM)
-3DS-LRDIMM
-Intel® Optane™ persistent memory 200 series modules
Jumlah Maksimum Saluran Memori
16
Bandwidth Memori Maks
204.8 GB/s
Jumlah Maksimum DIMM
24
Mendukung Memori ECC
Ya
Dukungan Memori Tetap Intel® Optane™ DC
Ya

Spesifikasi GPU

Grafis Terintegrasi
Ya
Output Grafis
VGA

Opsi Ekspansi

Revisi PCI Express
4.0
Jumlah Maksimal Jalur PCI Express
120
Konektor PCIe OCuLink (Dukungan NVMe)
8
Slot Riser 1: Jumlah Total Jalur
32
Slot Riser 2: Jumlah Total Jalur
24
Slot Riser 3: Jumlah Total Jalur
32
Slot Riser 4: Jumlah Total Jalur
32

Spesifikasi I/O

Jumlah Port USB
3
Konfigurasi USB
• One USB 3.0 port
• Two USB 3.0 ports (dual-stack)
Revisi USB
3.0
Jumlah Total Port SATA
2
Jumlah Tautan UPI
3
Konfigurasi RAID
0/1
Jumlah Port Serial
1
LAN Terintegrasi
1

Spesifikasi Paket

Konfigurasi CPU Maks
2

Teknologi Canggih

Advanced System Management key
Ya
Memori Intel® Optane™ Didukung
Ya
Intel® Virtualization Technology for Directed I/O (VT-d)
Ya
Intel® Node Manager
Ya
Intel® Advanced Management Technology
Ya
Versi TPM
2.0

Keamanan & Keandalan

Pentunjuk Baru Intel® AES
Ya
Intel® Trusted Execution Technology
Ya