Hal Penting

Tanggal Peluncuran
Q1'23
Status
Discontinued
Penghentian yang Diperkirakan
2023
EOL Announce
Friday, May 5, 2023
Pesanan Terakhir
Friday, June 30, 2023
Garansi terbatas 3 tahun
Ya
Perpanjangan Garansi Dapat Dibeli (Negara Tertentu)
Ya
Rincian Jaminan yang Diperpanjang Tambahan
Faktor Bentuk Sasis
1U Rack
Dimensi Sasis
767 x 438 x 43 mm
Faktor Bentuk Papan
18.79” x 16.84”
Termasuk Rel Rak
Tidak
Seri Produk Kompatibel
4th Gen Intel® Xeon® Scalable Processors, 5th Gen Intel® Xeon® Scalable Processors
Soket
Socket-E LGA4677
TDP
205 W
Termasuk Pembuang Panas
Ya
Chipset Board
Pasar Target
Mainstream
Papan Mudah Dipasang di Rak
Ya
Penyedia Daya
1600 W
Tipe Penyedia Daya
AC
# Catu Daya Disertakan
0
Kipas Redundan
Ya
Mendukung Daya Redundan
Ya
Sistem pendukung
Included
Hal yang Disertakan
(1) – 1U 2.5" chassis – iPN M36832-xxx
(1) – Server board – iPC M50FCP2SBSTD
(1) 12 x 2.5" combo HSBP – iPC CYPHSBP1212
(12) SSD mounting rail with extraction levers – iPN K71493-xxx
(12) 2.5" drive blanks – iPN K71491-xxx
(1) Riser #1 Bracket
(1) 1-Slot x16 LP PCIe riser card (Riser Slot #1) – iPC FCP1URISER1
(1) – Riser #2 Bracket - iPN K72604-001
(1) – Front panel (left) with two USB ports – iPN K48177- xxx
(1) – Front Panel (left) USB cable– iPN K67061- xxx
(1) – Front panel (right) with control panel – iPN K48178- xxx
(1) – Front panel (right) cable pin – iPN K67060- xxx
(8) – Dual-rotor system fans – iPC CYPFAN1UKIT
(16) – DIMM slot blanks – iPN M45676- xxx
(2) –Standard 1U heat sink- – iPC FCP1UHSSTD
(2) – E1A (XCC) processor clips – iPN AXXSPRXCCCC
(2) - E1B (MCC) processor clips - iPN AXXSPRMCCCC
(1) – Air baffle (left) – iPN K72602- xxx
(1) – Air baffle (right) – iPN K72603- xxx
(1) – Intel® RAID Maintenance Free Backup Unit (RMFBU) bracket
NOTE: NO PSU included

Informasi Tambahan

Keterangan
Integrated 1U system featuring an Intel® Server Board M50FCP2SBSTD,
supporting two 4th Generation Intel® Xeon® Scalable processors,
(12) 2.5" SSD with air cooling.

Memori & Penyimpanan

Jenis Memori
• DDR5 (RDIMM)
• 3DS-RDIMM
• 9x4 RDIMM
• Intel® Optane™ PMem 300 series
Jumlah Maksimum DIMM
32
Ukuran Memori Maks (bergantung jenis memori)
12 TB
# dari Drive Depan yang Didukung
12
Faktor Bentuk Drive Depan
Hot-swap 2.5" SSD
# dari Drive Internal yang Didukung
2
Faktor Bentuk Drive Internal
M.2 SSD
Dukungan Memori Tetap Intel® Optane™ DC
Ya

Spesifikasi GPU

Grafis Terintegrasi
Ya

Opsi Ekspansi

Revisi PCI Express
5.0
Slot Riser 1: Jumlah Total Jalur
16
Slot Riser 2: Jumlah Total Jalur
24
Slot Riser 3: Jumlah Total Jalur
16

Spesifikasi I/O

Dukungan Open Compute Port (OCP)
1 x 3.0
Jumlah Port USB
5
Jumlah Total Port SATA
10
Konfigurasi USB
• One USB 3.0 port at back panel
• Two USB 2.0 ports at back panel
• One USB 3.0 port front panel
• One USB 2.0 port front panel
Jumlah Tautan UPI
3
Konfigurasi RAID
0/1/5/10
Jumlah Port Serial
1

Spesifikasi Paket

Konfigurasi CPU Maks
2

Teknologi Canggih

Advanced System Management key
Ya
Memori Intel® Optane™ Didukung
Ya
Dukungan Intel® Remote Management Module
Ya
BMC Terintegrasi dengan IPMI
IPMI 2.0 & Redfish
Intel® Node Manager
Ya
Intel® Advanced Management Technology
Ya
Intel® Virtualization Technology for Directed I/O (VT-d)
Ya
Versi TPM
2.0

Keamanan & Keandalan

Total Memory Encryption Intel®
Ya
Intel® Trusted Execution Technology
Ya