Hal Penting

Tanggal Peluncuran
Q1'23
Status
Discontinued
Penghentian yang Diperkirakan
2023
EOL Announce
Friday, May 5, 2023
Pesanan Terakhir
Friday, June 30, 2023
Garansi terbatas 3 tahun
Ya
Perpanjangan Garansi Dapat Dibeli (Negara Tertentu)
Ya
Sistem Operasi yang Didukung
VMware*, Windows Server 2022*, Windows Server 2019*, Red Hat Linux*, SUSE Linux*, Ubuntu*, CentOS*
Faktor Bentuk Sasis
2U Rack front IO
Dimensi Sasis
591.4 x 216 x 81.9 mm (L x W x H)
Faktor Bentuk Papan
8.33” x 21.5”
Termasuk Rel Rak
Ya
Seri Produk Kompatibel
4th Generation Intel® Xeon® Scalable Processors
Soket
Socket- E LGA4677
TDP
350 W
Pembuang Panas
(1) – 2U air-cooled heat sink front – iPC DNP2UHSF
(1) – 2U air-cooled heat sink back – iPC DNP2UHSB
Termasuk Pembuang Panas
Ya
Chipset Board
Pasar Target
High Performance Computing, Scalable Performance
Papan Mudah Dipasang di Rak
Ya
Hal yang Disertakan
(1) – Intel® Server Board D50DNP1SB – iPC D50DNP1SB
(1) – 2U half-width module tray – iPN M44836-xxx
(1) – 2U management module air duct – iPN M44894-xxx
(1) – MCIO cable for 2U right riser – iPN M40564-xxx
(1) – MCIO cable for 2U left riser – iPN M40565-xxx
(2) – 2U riser bracket to support riser card DNP2UMRISER – iPN M44892-xxx
(2) – 2U low-profile PCIe MCIO riser card – iPC DNP2UMRISER
(2) – U.2 PCIe NVMe* SSD adapter card – iPN K50874-xxx
(2) – 2.5” tool-less SSD drive carrier – iPN J36439-xxx
(1) – 2U air-cooled heat sink front – iPC DNP2UHSF
(1) – 2U air-cooled heat sink back – iPC DNP2UHSB

Informasi Tambahan

Keterangan
Density-optimized 2U management module designed for HPC and AI applications.
Supports two 4th Gen Intel® Xeon® Scalable or Intel® Xeon® CPU Max Series processors and up to 16 DDR5 DIMMs.

Memori & Penyimpanan

Jenis Memori
• DDR5 RDIMM
• DDR5 3DS-RDIMM
• DDR5 9x4 RDIMM
Jumlah Maksimum DIMM
16
Ukuran Memori Maks (bergantung jenis memori)
2 TB
# dari Drive Depan yang Didukung
2
Faktor Bentuk Drive Depan
Hot-swap 2.5"
# dari Drive Internal yang Didukung
2
Faktor Bentuk Drive Internal
M.2 SSD
Dukungan Memori Tetap Intel® Optane™ DC
Tidak

Spesifikasi GPU

Grafis Terintegrasi
Ya

Opsi Ekspansi

Revisi PCI Express
5.0
Slot Riser 1: Jumlah Total Jalur
24
Slot Riser 2: Jumlah Total Jalur
24

Spesifikasi I/O

Jumlah Port USB
3
Jumlah Total Port SATA
2
Konfigurasi USB
• One USB 3.0 port on the front panel
• Two USB 3.0 ports via breakout cable
Jumlah Tautan UPI
3
Jumlah Port Serial
1
LAN Terintegrasi
10Gb Ethernet (RJ45) and 1Gb Ethernet (RJ45)
Jumlah Port LAN
2

Spesifikasi Paket

Konfigurasi CPU Maks
2

Teknologi Canggih

Advanced System Management key
Ya
Memori Intel® Optane™ Didukung
Tidak
Dukungan Intel® Remote Management Module
Ya
BMC Terintegrasi dengan IPMI
IPMI 2.0 and Redfish compliant
Intel® Node Manager
Ya
Intel® Virtualization Technology for Directed I/O (VT-d)
Ya
Intel® Rapid Storage Technology enterprise
Ya
Versi TPM
2.0

Keamanan & Keandalan

Total Memory Encryption Intel®
Ya
Intel® Software Guard Extensions (Intel®SGX)
Yes with Intel® SPS
Pentunjuk Baru Intel® AES
Ya
Intel® Trusted Execution Technology
Ya