Hal Penting

Tanggal Peluncuran
Q1'23
Status
Discontinued
Penghentian yang Diperkirakan
2023
EOL Announce
Friday, May 5, 2023
Pesanan Terakhir
Friday, June 30, 2023
Garansi terbatas 3 tahun
Ya
Perpanjangan Garansi Dapat Dibeli (Negara Tertentu)
Ya
Sistem Operasi yang Didukung
VMware*, Windows Server 2022*, Windows Server 2019*, Red Hat Linux*, SUSE Linux*, Ubuntu*, CentOS*
Faktor Bentuk Sasis
2U Front IO, 4 node Rack
Dimensi Sasis
597.7 x 437.1 x 40.6 mm (L x W x H)
Faktor Bentuk Papan
8.33” x 21.5”
Termasuk Rel Rak
Ya
Seri Produk Kompatibel
4th Gen Intel® Xeon® Scalable Processors, 5th Gen Intel® Xeon® Scalable Processors
Soket
Socket- E LGA4677
TDP
350 W
Pembuang Panas
(1) – D50DNP compute module liquid-cooling loop – iPC DNPLCLPCM
(1) – D50DNP accelerator module liquid-cooling loop – iPC DNPLCLPAM
Termasuk Pembuang Panas
Ya
Chipset Board
Pasar Target
High Performance Computing, Scalable Performance
Papan Mudah Dipasang di Rak
Ya
Hal yang Disertakan
(1) – Intel® Server Board D50DNP1SB – iPC D50DNP1SB
(1) – carrier baseboard (CBB) – iPC DNPLCPVCCBB
(1) – 1U full-width module tray – iPN M62560 -xxx
(1) – MCIO cable from P1_PE0 connector to CBB – iPN M82302 -xxx
(1) – MCIO cable from P0_PE2 connector to CBB – iPN M82304 -xxx
(1) – MCIO cable from P0_PE1 connector to CBB – iPN M82313 -xxx
(1) – MCIO cable from P1_PE3 connector to CBB – iPN M82316 -xxx
(1) – Signal cable from J_MISC connector to CBB – iPN M82334 -xxx
(2) – 1U riser bracket to support riser cards DNP1URISER and DNP1UMRISER – iPN M44890-xxx
(1) – 1U low-profile PCIe standard riser card – iPC DNP1URISER
(1) – 1U low-profile PCIe MCIO riser card – iPC DNP1UMRISER
(1) – MCIO cable for 1U left riser – iPN M40563-xxx
(1) – Compute module liquid-cooling loop – iPC DNPLCLPCM
(1) – Accelerator module liquid-cooling loop – iPC DNPLCLPAM
(1) – Power cable from 12 V to 48 V converter to CBB – iPN M52679 -xxx
(1) – Power cable from 12 V to 48 V converter to CBB – iPN M52680 -xxx
Kartu Riser Disertakan
1U PCIe MCIO Riser DNP1UMRISER

Informasi Tambahan

Keterangan
Density-optimized 1U liquid-cooled compute module designed for HPC and AI application.
Supports two 4th Gen Intel® Xeon® Scalable or Intel® Xeon® CPU Max Series processors with 16 DDR5 DIMMs and up to four Intel® Data Center GPU Max Series modules.

Memori & Penyimpanan

Jenis Memori
• DDR5 RDIMM
• DDR5 3DS-RDIMM
• DDR5 9x4 RDIMM
Jumlah Maksimum DIMM
16
Ukuran Memori Maks (bergantung jenis memori)
2 TB
# dari Drive Internal yang Didukung
2
Faktor Bentuk Drive Internal
M.2 SSD
Dukungan Memori Tetap Intel® Optane™ DC
Tidak

Spesifikasi GPU

Grafis Terintegrasi
Ya

Opsi Ekspansi

Revisi PCI Express
5.0
Slot Riser 1: Jumlah Total Jalur
24
Slot Riser 2: Jumlah Total Jalur
24

Spesifikasi I/O

Jumlah Port USB
3
Jumlah Total Port SATA
2
Konfigurasi USB
• One USB 3.0 port on the front panel
• Two USB 3.0 ports via breakout cable
Jumlah Tautan UPI
3
Jumlah Port Serial
1
LAN Terintegrasi
10Gb Ethernet (RJ45) and 1Gb Ethernet (RJ45)
Jumlah Port LAN
2

Spesifikasi Paket

Konfigurasi CPU Maks
2

Teknologi Canggih

Advanced System Management key
Ya
Memori Intel® Optane™ Didukung
Tidak
Dukungan Intel® Remote Management Module
Ya
BMC Terintegrasi dengan IPMI
IPMI 2.0 and Redfish compliant
Intel® Node Manager
Ya
Intel® Rapid Storage Technology enterprise
Ya
Versi TPM
2.0

Keamanan & Keandalan

Total Memory Encryption Intel®
Ya
Intel® Software Guard Extensions (Intel®SGX)
Yes with Intel® SPS
Pentunjuk Baru Intel® AES
Ya
Intel® Trusted Execution Technology
Ya