Hal Penting

Tanggal Peluncuran
Q1'16
Status
Discontinued
Penghentian yang Diperkirakan
Q3'20
Garansi terbatas 3 tahun
Ya
Perpanjangan Garansi Dapat Dibeli (Negara Tertentu)
Ya
Rincian Jaminan yang Diperpanjang Tambahan
Faktor Bentuk Sasis
2U, Spread Core Rack
Dimensi Sasis
16.93" x 27.95" x 3.44"
Faktor Bentuk Papan
Custom 16.7" x 17"
Termasuk Rel Rak
Tidak
Seri Produk Kompatibel
Intel® Xeon® Processor E5-2600 v4 Family
Soket
Socket R3
TDP
145 W
Pembuang Panas
2
Termasuk Pembuang Panas
Ya
Chipset Board
Pasar Target
Cloud/Datacenter
Papan Mudah Dipasang di Rak
Ya
Penyedia Daya
1100 W
Tipe Penyedia Daya
AC
# Catu Daya Disertakan
1
Kipas Redundan
Ya
Mendukung Daya Redundan
Supported, requires additional power supply
Sistem pendukung
Included
Hal yang Disertakan
(1) Intel® Server Board S2600WT w/ Dual 10GbE; (1) airduct; (1) control panel on rack handle (Includes: Integrated control panel & USB Port) (A2UHANDLKIT); (24) 2.5 inch hot-swap drive carrier (FXX25HSCAR); (3) 12Gb SAS backplanes (FXX8X25S3HSBP); (1) Backplane 250mm I2C cable; (1) backplane power cable; (2) 730mm Cables with straight SFF8643 to straight SFF8643 connectors (AXXCBL730HDHD); (4) 875mm cable for straight SFF8643 to SFF8643 connectors (AXXCBL875HDHD); (2) processor heatsinks (FXXCA84X106HS); (2) risers with 3 x8 PCI* 3.0 slots on each (2x FHFL 1x FHHL) (A2UL8RISER2); (1) rear-accessible dual 2.5 inch hot-swap drive cage (Includes: drive carriers, drive blanks, SATA data/SGPIO cable harness, and I2C cable) (A2UREARHSDK); (1) Rear Backplane power cable; (1) battery backup unit bracket with three mounting locations over the airduct; (1) 1100W AC power supply (AXX1100PCRPS)

Informasi Tambahan

Keterangan
Integrated 2U system featuring an Intel® Server Board S2600WTTR supporting 24 2.5 inch hot-swap drives, dual 10-GbE LAN, 24 DIMMs, one 1100W redundant-capable power supply, enterprise class I/O, with built in discrete management network interface.

Memori & Penyimpanan

Jenis Memori
DDR4-1600/1866/2133/2400
Jumlah Maksimum DIMM
24
Ukuran Memori Maks (bergantung jenis memori)
1.5 TB
# dari Drive Depan yang Didukung
24
Faktor Bentuk Drive Depan
Hot-swap 2.5"
# dari Drive Belakang yang Didukung
2
Faktor Bentuk Drive Belakang
Hot-swap 2.5"

Spesifikasi GPU

Grafis Terintegrasi
Ya

Opsi Ekspansi

PCIe x8 Gen 3
6
Konektor untuk Intel® I/O Expansion Module x8 Gen 3
1
Konektor untuk Intel® Integrated RAID Module
1

Spesifikasi I/O

Jumlah Port USB
5
Jumlah Total Port SATA
10
Konfigurasi RAID
SW RAID 0, 1, 10, optional 5
Jumlah Port Serial
2
LAN Terintegrasi
2x 10GbE
Jumlah Port LAN
2
Dukungan Drive Optik
Tidak
Firewire
Tidak
Port SAS terintegrasi
0
Opsi USB (eUSB) Solid-State Drive tertanam
Ya
InfiniBand* Terintegrasi
Tidak

Spesifikasi Paket

Konfigurasi CPU Maks
2

Teknologi Canggih

Dukungan Intel® Remote Management Module
Ya
BMC Terintegrasi dengan IPMI
IPMI 2.0 with OEM extensions
Intel® Node Manager
Ya
Intel® On-Demand Redundant Power
Ya
Intel® Advanced Management Technology
Ya
Intel® Server Customization Technology
Ya
Intel® Build Assurance Technology
Ya
Intel® Efficient Power Technology
Ya
Intel® Quiet Thermal Technology
Ya
Intel® Virtualization Technology for Directed I/O (VT-d)
Ya
Intel® Matrix Storage Technology
Tidak
Intel® Rapid Storage Technology
Tidak
Intel® Rapid Storage Technology enterprise
Ya
Intel® Quiet System Technology
Ya
Intel® Fast Memory Access
Ya
Intel® Flex Memory Access
Ya
Intel® I/O Acceleration Technology
Ya
Versi TPM
1.2/2.0