Hal Penting

Tanggal Peluncuran
Q3'17
Status
Discontinued
Penghentian yang Diperkirakan
Q3'19
EOL Announce
Monday, April 22, 2019
Pesanan Terakhir
Thursday, August 22, 2019
Atribut Penerimaan Terakhir
Sunday, December 22, 2019
Garansi terbatas 3 tahun
Ya
Perpanjangan Garansi Dapat Dibeli (Negara Tertentu)
Ya
Rincian Jaminan yang Diperpanjang Tambahan
Faktor Bentuk Sasis
1U, Spread Core Rack
Dimensi Sasis
16.93" x 27.95" x 1.72"
Faktor Bentuk Papan
Custom 16.7" x 17"
Termasuk Rel Rak
Tidak
Seri Produk Kompatibel
Intel® Xeon® Scalable Processors
Soket
Socket P
TDP
165 W
Pembuang Panas
(2) 1U Standard Heat Sink FXXCA78X108HS
Termasuk Pembuang Panas
Ya
Chipset Board
Pasar Target
Full-featured
Papan Mudah Dipasang di Rak
Ya
Penyedia Daya
1100 W
Tipe Penyedia Daya
AC
# Catu Daya Disertakan
1
Kipas Redundan
Tidak
Mendukung Daya Redundan
Supported, requires additional power supply
Sistem pendukung
Included
Hal yang Disertakan
(1) Intel® Server Board S2600WFT (Dual 10GbE LAN) S2600WFT, (2) Riser card assembly with 1 slot PCIe x16 riser card F1UL16RISER3, (4) 3.5” Hot-swap drive bays with drive carriers and drive blanks: Includes (1) 12 Gb SAS backplane FR1304S3HSBP, (4) 3.5” hot swap drive tool less carriers FXX35HSCAR2, (1) Standard control panel assembly FXXFPANEL2, (1) Front I/O Panel assembly (VGA and 2 x USB), (1) 150mm Backplane I2C cable, (1) 850mm MiniSAS HD Cable AXXCBL850HDHRT, (1) 350mm Backplane power cable, (1) Air duct, (6) Dual rotor system fans FR1UFAN10PW, (8) DIMM slot blanks, (1) Chassis Stiffener Bar, (1) 1100W power supply module AXX1100PCRPS, (2) CPU heat sinks FXXCA78X108HS, (2) CPU heat sink “No CPU” Label inserts, (2) Standard CPU Carrier, (1) Power supply bay blank insert, (2) Chassis handle (1 set) installed A2UHANDLKIT3, (2) AC Power Cord retention strap assembly
Tanggal Kedaluwarsa Ketersediaan Desain Baru
Monday, July 11, 2022

Informasi Tambahan

Keterangan
Integrated 1U system featuring an Intel® Server Board S2600WFT with Dual 10GbE LAN, four 3.5 inch hot-swap drives, 24 DIMMs, one 1100W redundant-capable power supply, Intel® OCP Module for adding additional features without losing a PCIe add-in slot

Memori & Penyimpanan

Jenis Memori
Registered/Load Reduced DDR4-2133/2400/2666 MHz
Jumlah Maksimum DIMM
24
Ukuran Memori Maks (bergantung jenis memori)
1.5 TB
# dari Drive Depan yang Didukung
4
Faktor Bentuk Drive Depan
Hot-swap 3.5" HDD or 2.5" SSD
# dari Drive Internal yang Didukung
2
Faktor Bentuk Drive Internal
M.2 SSD

Opsi Ekspansi

Slot Super Riser PCIe x24
2
Konektor untuk Intel® I/O Expansion Module x8 Gen 3
1
Konektor untuk Intel® Integrated RAID Module
1
Slot Riser 1: Jumlah Total Jalur
24
Slot Riser 1: Konfigurasi Slot Disertakan
1x PCIe Gen3 x16
Slot Riser 2: Jumlah Total Jalur
24
Slot Riser 2: Konfigurasi Slot Disertakan
1x PCIe Gen3 x16

Spesifikasi I/O

Jumlah Port USB
5
Jumlah Total Port SATA
10
Konfigurasi RAID
SW RAID 0, 1, 10, optional 5
Jumlah Port Serial
2
LAN Terintegrasi
2x 10GbE
Jumlah Port LAN
2
Dukungan Drive Optik
Ya

Spesifikasi Paket

Konfigurasi CPU Maks
2

Teknologi Canggih

Memori Intel® Optane™ Didukung
Ya
Dukungan Intel® Remote Management Module
Ya
BMC Terintegrasi dengan IPMI
IPMI 2.0 & Redfish
Intel® Node Manager
Ya
Intel® On-Demand Redundant Power
Ya
Intel® Advanced Management Technology
Ya
Intel® Server Customization Technology
Ya
Intel® Build Assurance Technology
Ya
Intel® Efficient Power Technology
Ya
Intel® Quiet Thermal Technology
Ya
Intel® Virtualization Technology for Directed I/O (VT-d)
Ya
Intel® Rapid Storage Technology enterprise
Ya
Intel® Quiet System Technology
Ya
Intel® Fast Memory Access
Ya
Intel® Flex Memory Access
Ya
Versi TPM
2.0 (optional module)

Intel® Transparent Supply Chain

Mencakup Pernyataan Kesesuaian dan Sertifikat Platform
Ya