Info Penting

Tanggal Peluncuran
Q1'21
Status
Launched
Penghentian yang Diperkirakan
2022
EOL Announce
Monday, March 7, 2022
Pesanan Terakhir
Friday, May 6, 2022
Atribut Penerimaan Terakhir
Tuesday, July 5, 2022
Garansi terbatas 3 tahun
Ya
Faktor Bentuk Sasis
2U Rack
Dimensi Sasis
841 mm x 435 mm x 87 mm
Faktor Bentuk Papan
610mm x 424mm, Thickness 2.34mm
Termasuk Rel Rak
Ya
Seri Produk Kompatibel
3rd Generation Intel® Xeon® Scalable Processors
Soket
P+
TDP
250 W
Pembuang Panas
(2) 2U Front CPU Heatsink
(2) 2U Rear CPU Heatsink
Termasuk Pembuang Panas
Ya
Chipset Board
Pasar Target
Mainstream
Papan Mudah Dipasang di Rak
Ya
Penyedia Daya
2000 W
Tipe Penyedia Daya
AC
# Catu Daya Disertakan
2
Kipas Redundan
Ya
Mendukung Daya Redundan
Ya
Sistem pendukung
Included
Hal yang Disertakan
(1) Intel® Server Chassis M70KLP2UCHHH
(1) Intel® Server Board M70KLP2SB
(1) 2U PCIe Riser M.2 Connector KLP2UM2RISER
(1) SlimSAS M.2 Cable KLPCBLSSM2
(1) 2U 8x2.5" SAS/NVME Hot-Swap Backplane KLP08HSBP
(1) DC Power Cable Mid-HSBP KLPCBLDCPM - 230mm
(1) Comm Cable HSBP-Mid KLPCBLCOM224M - 820mm
(6) 2U Fan Kit KLP2UFAN
(1) Fan Bracket
(8) 2.5" Hot-Swap Drive Carrier KLP25HSCAR
(2) 2000W AC Common Redundant Power Supply KLP2000CRPS
(1) 2U Rail Kit (Full Extension) KLPRAILK
(1) Front I/O Panel assembly (VGA+1x USB 3.0+1x USB 2.0) installed
(1) 2U Server airduct
(48) Blank DIMM slots
(4) CPU heat sink + CPU Clips
(2) Front Panel 8 Drive Filler Plate
(1) PDB
(1) PDB Cable
Note: Risers supporting additional PCIe 3.0 cards, drive carriers and backplanes (for (16) or (24) 2.5” drive support) sold separately.

Informasi Tambahan

Keterangan
Integrated 2U server system supporting
(4) 3rd Generation Intel® Xeon® Processors.
(8) 2.5” drives
(2) x16 Half Height Half Length PCIe 3.0 cards
(4) x8 Half Height Half Length PCIe 3.0 cards.

Memori & Penyimpanan

Profil Penyimpanan
Hybrid Storage Profile
Jenis Memori
DDR4, RDIMMs, LDRIMMs and Intel® Optane™
Persistent Memory.
15 TB with Intel® Optane™ Persistent Memory
Jumlah Maksimum DIMM
48
Ukuran Memori Maks (bergantung jenis memori)
6 TB
Kapasitas Penyimpanan Maksimal
192 TB
# dari Drive Depan yang Didukung
24
Faktor Bentuk Drive Depan
Hot-swap 2.5"
# dari Drive Internal yang Didukung
2
Faktor Bentuk Drive Internal
M.2 SSD
Dukungan Memori Tetap Intel® Optane™ DC
Ya

Opsi Ekspansi

PCIe x8 Gen 3
4
PCIe x16 Gen 3
2
Konektor untuk Intel® Integrated RAID Module
1
Slot Riser 1: Jumlah Total Jalur
40
Slot Riser 1: Konfigurasi Slot Disertakan
2x PCIe Gen3 x16 + 1x PCIe Gen3 x8
Slot Riser 2: Jumlah Total Jalur
24
Slot Riser 2: Konfigurasi Slot Disertakan
3x PCIe Gen3 x8

Spesifikasi I/O

Jumlah Port USB
5
Konfigurasi USB
One USB 2.0 port on front panel
One USB 3.0 port on front panel
Two USB 3.0 port on rear panel
One USB 2.0 port on board
Jumlah Total Port SATA
1
Jumlah Tautan UPI
6
Konfigurasi RAID
1, 5, 6, and 10
Jumlah Port Serial
2

Spesifikasi Paket

Konfigurasi CPU Maks
4

Teknologi Canggih

Memori Intel® Optane™ Didukung
Ya
BMC Terintegrasi dengan IPMI
IPMI 2.0 & Redfish
Intel® On-Demand Redundant Power
Ya
Intel® Virtualization Technology for Directed I/O (VT-d)
Ya
Versi TPM
2.0